On the PCB line, the solder mask cure is where yield lives or dies. Fine traces and micro-vias need a UV cure that goes deep without cooking the substrate. If the spectrum is off or the output drifts, you end up with under-cured ink—adhesion fails, and bridging shows up on high-density boards. What matters under the hood We run a 3000W gallium iodide UV bulb, tuned for the 365nm band where solder mask photoinitiators absorb cleanly. The gallium iodide doping narrows the bandwidth and keeps excess IR in check, so board temperature stays manageable while peak irradiance stays high. At 3000W rated output, the lamp delivers the energy density needed for rapid cross-linking. Matched to a high-reflectivity dichroic reflector, you’re typically pushing past 800 mJ/cm² at the substrate plane. Run it within the specified voltage window, keep arc stability tight, and the spectrum holds steady over 2,000 hours—irradiance drops less than 8%. Why this works on the floor In solder mask curing, that 365nm peak lines up with the ink’s photoinitiator absorption, so cross-linking is uniform across dense features and tight clearances. The focused spectrum cuts down surface-only curing, which means you get through-cure without skinning. The payoff: fewer rejects, consistent pencil hardness, and solvent resistance that meets IPC test criteria. Multi-layer boards move faster, and you get stable adhesion on 50μm lines, all within the 3000W envelope and reflector efficiency. A few practical notes Match lamp orientation and focal distance to your printer’s reflector geometry. If it’s misaligned, irradiance at the board drops—and you’ll drive hot spots on the bulb. Make sure the ballast is compatible with gallium iodide ignition and current control; otherwise you’ll see spectral drift. For ozone-free operation, confirm the quartz envelope and reflector coating have the right cutoff rating. Plan replacements around 2,000–3,000 hours. That keeps spectral stability consistent and the cure profile the same shift after shift.